Solvent-free adhesive can be applied to complex devices on the solvent-free laminating machine called solvent-free compound very broad scope, its environmental, health, and efficient features, especially for food and drug packaging industries. There may be a composite substrate BOPP, PET, Nylon, CPP, PE, VMPET, VMCPP, PVC, aluminum foil, paper and so on. Substrate thickness is generally applicable in 7um-120um.
Versatile solvent-free laminating machine performance and features:
1 glue and composite dual-motor, dual-frequency synchronous speed of the previous shaft transmission structure, expected to go smoothly, to achieve synchronization line speed to ensure the substrate does not stretch.
2 bridge dual bake heating increased the temperature so that the composite faster.
3 scraping or extrusion coating in two different ways according to any process selection.
4 silver lock thermostat control in the best condition to Wenzhou.
5 adhesive composite part with separate drive, compact structure, less failure.
6 high efficiency, low cost, energy saving.